TRESKY soldering uses formic acid vapor in combination with nitrogen (HCOOH + N2), which provides advantages in optoelectronics and photonics assembly and interconnect technologies. Formic acid reliably reduces oxides and completely eliminates flux. The use of formic acid also ensures good surface wettability, creating suitable conditions for complex welding processes. This module is used for eutectic soldering and thermocompression welding, for example with indium. All bonding processes use nitrogen-enriched formic acid (HCOOH) using a so-called bubbler. A mixture of nitrogen vapor and formic acid is introduced into the treatment chamber in a controlled manner and extracted.